AIM Solder Paste
AIM’s complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications.
AIM solder paste is available in no clean, water soluble, and RMA formulations with a wide variety of alloy powder sizes and offerings including AIM’s proven REL alloys, SAC, SN100C® and lead-based solders. AIM’s alloy and flux combinations provide high quality performance for a wide variety of SMT applications. In addition to SAC based SMT paste, AIM offers low temperature solder paste and jetting solder paste.
Useful Links:
Solder Powder Size Quick Guide
Solder Paste Powder: When to Downsize
Understanding Solder Paste Powder Size
2025: The Year of Type 5 Solder Paste
Search

No Clean
Water Soluble
Rosin Based
Low Temperature
AIM’s no clean solder paste combines performance and reliability without the expense of cleaning. Designed to provide stable transfer efficiencies, powerful wetting, and low voiding, AIM no clean solder pastes address current and future assembly challenges. AIM’s full line of no clean solder paste is available in a wide selection of alloys to meet your process requirements. AIM has partnered with industry cleaner and chemistry manufacturers to ensure residue can be removed when necessary.
H10 Halogen-Free Solder Paste
M8 Solder Paste
V9 Low-Voiding Solder Paste
J8 Solder Paste
NC273LT Solder Paste
NC259FPA Solder Paste
NC257MD Solder Paste